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IPC-J-STD-001G: Requirements for Soldered …

IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies Developedby the J-STD-001Task Group(5-22a)of the Soldering Subcommittee(5-22) of the Assembly& JoiningCommittee(5-20)

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Text of IPC-J-STD-001G: Requirements for Soldered …

IPC J-STD-001GRequirements forSoldered Electrical andElectronic AssembliesDeveloped by the J-STD-001 Task Group (5-22a) of the Soldering Subcommittee (5-22) of the Assembly & Joining Committee (5-20) of IPCUsers of this publication are encouraged to participate in the development of future :IPCSupersedes:J-STD-001F WAM1 -February 2016J-STD-001F - July 2014J-STD-001E - April 2010J-STD-001D - February 2005J-STD-001C - March 2000J-STD-001B - October 1996J-STD-001A - April 1992If a conflict occursbetween the English andtranslated versions of thisdocument, the Englishversion will takeprecedence. Table of ........................................ ........................... ........................................ ........................ ........................................ ............... Units and Applications ................ Verification of Dimensions ................................. of Requirements ................................ Hardware Defects and Process Indicators ......... Material and Process Nonconformance ............. Requirements ........................................ of Precedence ........................................ ... Conflict ........................................ ........................ Clause References ........................................ ...... Appendices ........................................ .................. and Definitions ........................................ Diameter ........................................ ...................... Disposition ........................................ .................. Electrical Clearance ........................................ .... FOD (Foreign Object Debris) ............................ High Voltage ........................................ ............... Manufacturer (Assembler) .................................. Objective Evidence ........................................ ..... Process Control ........................................ ........... Proficiency ........................................ .................. Solder Destination Side ...................................... Solder Source Side ........................................ ..... Supplier ........................................ ....................... User ........................................ ............................. Wire Overwrap ........................................ ........... Wire Overlap ........................................ .............. Flowdown .................................... Personnel Proficiency ........................................ . Acceptance Requirements .................................. General Assembly Requirements ....................... Miscellaneous Requirements .............................. Health and Safety ........................................ ....... Procedures for Specialized Technologies .......... 52APPLICABLE ........................................ .............................. ........................................ ........................ Industry Standards ..................................... ........................................ ......................... Discharge Association ................... Electrotechnical Commission ....... International ........................................ ....... Standards ........................................ ...... 73MATERIALS, COMPONENTS AND ........................................ ..................... ........................................ .......................... Solder Lead Free ........................................ ..... Solder Purity Maintenance ................................. ........................................ ............................. Flux Application ........................................ ......... Paste ........................................ ................ Preforms ........................................ .......... ........................................ .................... Strippers ........................................ ..... ........................................ ................ Component and Seal Damage ............................ Coating Meniscus ........................................ ..... and Equipment ........................................ 104GENERAL SOLDERING AND Discharge (ESD) ......................... ........................................ .................... Controls .................................... and Humidity ............................... ........................................ ..................... Assembly Operations .............................. ........................................ .............. Maintenance ................................ of Component Surface Finishes ....... Removal ........................................ ........... Metallic Surface Finishes Removal ....... Protection ........................................ ... of Nonsolderable Parts ....................... Cleanliness Requirements ......... Part Mounting Requirements ............. Requirements ...................................... Deformation Limits ................................. Obstruction ........................................ ...... Component Isolation ................... Coverage Limits ............................... Mounting of Parts on Parts (Stacking ofComponents) ........................................ ............. 12October 2017IPC Connectors and Contact Areas ......................... Handling of Parts ........................................ ...... Preheating ........................................ ................. Controlled Cooling ........................................ ... Drying/Degassing ........................................ ..... Holding Devices and Materials ........................ Machine (Nonreflow) Soldering ...................... Machine Controls ........................................ ..... Solder Bath ........................................ ............... Reflow Soldering ........................................ ...... Intrusive Soldering (Paste-in-Hole) ................. Solder Connection ........................................ .... Exposed Surfaces ........................................ ...... Solder Connection Anomalies .......................... Partially Visible or Hidden SolderConnections ........................................ .............. Shrinkable Soldering Devices ................. 145WIRES AND TERMINAL and Cable Preparation ............................. Damage ........................................ .... Damage ........................................ ......... of Stranded Wire Forming .............. Terminals ........................................ ....... , Turret and Slotted TerminalInstallation ........................................ ................ Damage ........................................ .......... Damage ........................................ ......... Flange Angles ........................................ Mounting Mechanical .................... Mounting Electrical ....................... Mounting Soldering ....................... to Terminals ..................................... Requirements ...................................... and Straight Pin Terminals .................... Terminals ........................................ Terminals ........................................ ...... Terminals ........................................ ........ or Perforated Terminals ....................... Cup and Hollow Cylindrical Terminals Placement ........................................ .................. to Terminals ..................................... Terminals ........................................ Terminal ........................................ ....... Cup and Hollow Cylindrical Terminals Soldering ........................................ ................... Wires ........................................ ............ Insulation ........................................ .................. Wire Routing ........................................ ............ Wire Staking ........................................ ............. Unpopulated Land or Via Lap Soldered ...... Supported Holes ........................................ ....... SMT ........................................ .......................... 236THROUGH-HOLE MOUNTING Terminations General ............ Lead Forming ........................................ ........... Termination Requirements ............................... Lead Trimming ........................................ ......... Interfacial Connections ..................................... Coating Meniscus In Solder ............................. Holes ........................................ ....... Solder Application ........................................ .... Through-Hole Component Lead Soldering ..... Holes ........................................ ... Lead Termination Requirements forUnsupported Holes ........................................ ... 277SURFACE MOUNTING OF Mount Device Lead ............................ Plastic Components ........................................ .. Forming ........................................ ..................... Unintentional Bending ...................................... Flat Pack Parallelism ........................................ Surface Mount Device Lead Bends ................. Flattened Leads ........................................ ......... Parts Not Configured for Surface Mounting ... Component Body Clearance ............... Axial-Leaded Components ............................... Configured for Butt/I Lead Mounting .... of Surface Mount Components ..... Requirements ................................... Misaligned Components ................................... Unspecified and Special Requirements ............ Bottom Only Chip ComponentTerminations ........................................ ............. Rectangular or Square End ChipComponents 1, 2, 3 or 5 SideTermination(s) ........................................ ........... End Cap Terminations ................... Terminations .................................. Gull Wing Leads ....................................... Round or Flattened (Coined) GullWing Leads ........................................ ............... Lead Terminations ........................................ . 37IPC J-STD-001GOctober Butt/I Terminations ........................................ ... Flat Lug Leads and Flat Unformed Leads ...... Tall Profile Components Having BottomOnly Terminations ........................................ .... Inward Formed L-Shaped Ribbon Leads ........ Surface Mount Area Array Packages ............... Bottom Termination Components (BTC) ........ Components with Bottom Thermal PlaneTerminations (D-Pak) ....................................... Flattened Post Connections .............................. P-Style Terminations ........................................ SMT Terminations ........................ 508CLEANING PROCESS Exemptions .................................... Cleaning ........................................ .. Cleanliness .................................... Foreign Object Debris (FOD) .......................... Flux Residues and Other Ionic or OrganicContaminants ........................................ ............ Post-Soldering Cleanliness Designator ............ Cleaning Option ........................................ ........ Test for Cleanliness ........................................ .. Testing ........................................ ....................... 529PCB Circuit Board Damage ......................... Blistering/Delamination .................................... Weave Exposure/Cut Fibers ............................. Haloing ........................................ ...................... Edge Delamination ........................................ ... Land/Conductor Separation .............................. Land/Conductor Reduction in Size .................. Flexible Circuitry Delamination ...................... Flexible Circuitry Damage ............................... Burns ........................................ ......................... Non-Soldered Edge Contacts ........................... Measles ........................................ ..................... Crazing ........................................ ...................... ........................................ ..................... and Twist (Warpage) ................................ ........................................ .......... 5410COATING, ENCAPSULATION AND STAKING(ADHESIVE)....................... ................................... Coating Materials ....................... Coating Masking ........................ Coating Application .................... Coating on Components ................ Thickness ........................................ .................. Uniformity ........................................ ................ Transparency ........................................ ............. Bubbles and Voids ........................................ .... Delamination ........................................ ............. Foreign Objects Debris .................................... Other Visual Conditions ................................... Inspection ........................................ .................. Rework or Touchup of Conformal Coating ..... Encapsulation ........................................ ............ Application ........................................ ................ Performance Requirements .............................. Rework of Encapsulant Material ..................... Encapsulant Inspection ..................................... ........................................ ...................... Application ....................................... Adhesive ........................................ ... (Inspection) ........................................ .. 5811WITNESS (TORQUE/ANTI-TAMPERING) 5812PRODUCT Methodology ................................... Verification Inspection ........................ Inspection ........................................ ...... Control Requirements ......................... Determination ............................ Process Control ................................ 6013REWORK AND ........................................ ...................... ........................................ ........................ Rework/Repair Cleaning .......................... 61APPENDIX AGuidelines for Soldering Toolsand 62APPENDIX BMinimum Electrical Clearance Electrical Conductor 64APPENDIX CJ-STD-001 Guidance onObjective Evidence ofMaterial 66FiguresFigure 1-1Overwrap ........................................ ................. 4Figure 1-2Overlap ........................................ .................... 4Figure 4-1Hole Obstruction ........................................ .... 12Figure 4-2Acceptable Wetting Angles ........................... 13Figure 5-1Insulation Thickness ...................................... 15October 2017IPC J-STD-001GixFigure 5-2Flange Damage ........................................ ..... 16Figure 5-3Flare Angles ........................................ .......... 16Figure 5-4Terminal Mounting Mechanical .................. 17Figure 5-5Terminal Mounting Electrical ...................... 17Figure 5-6Insulation Clearance Measurement .............. 17Figure 5-7Service Loop for Lead Wiring ....................... 18Figure 5-8Cup and Hollow Cylindrical Terminal Solder Height ........................................ ......... 18Figure 5-9Wires on Intermediate Turret Terminal .......... 18Figure 5-10Wire and Lead Placement ............................. 19Figure 5-11Bifurcated Terminal Side Route Placementwith Wrap ........................................ .............. 19Figure 5-12Bifurcated Terminal Side Route Placement Straight Though and Staked ......................... 20Figure 5-13Bifurcated Terminal Top and Bottom RouteConnection ........................................ ............ 20Figure 5-14Slotted Terminal ........................................ ..... 21Figure 5-15Hook Terminal Wire Placement ..................... 21Figure 5-16Acceptable Pierced or Perforated TerminalWire Placement ........................................ ..... 22Figure 5-17Solder Depression ........................................ . 22Figure 5-18Cup and Hollow Cylindrical Terminals Vertical Fill of Solder ..................................... 22Figure 6-1Component Lead Stress Relief Examples .... 24Figure 6-2Lead Bends ........................................ ........... 25Figure 6-3Lead Trimming ........................................ ....... 26Figure 6-4Vertical Fill Example ...................................... 26Figure 7-1Surface Mount Device Lead Forming ........... 28Figure 7-2Surface Mount Device Lead Forming ........... 28Figure 7-3Bottom Only Terminations ............................. 31Figure 7-4Rectangular or Square End ChipComponents ........................................ .......... 32Figure 7-5Cylindrical End Cap Terminations ................. 33Figure 7-6Castellated Terminations ............................... 34Figure 7-7Flat Gull Wing Leads ..................................... 35Figure 7-8Round or Flattened (Coined) GullWing Leads ........................................ ........... 36Figure 7-9J Leads ........................................ .................. 37Figure 7-10Butt/I Terminations for ModifiedThrough-Hole Leads ...................................... 38Figure 7-11Butt/I Terminations for SolderCharged Leads ........................................ ...... 39Figure 7-12AFlat Lug Leads ........................................ ...... 41Figure 7-12BFlat Unformed Leads ..................................... 41Figure 7-13Tall Profile Components Having BottomOnly Terminations ........................................ .. 42Figure 7-14Inward Formed L-Shaped Ribbon Lead ........ 43Figure 7-15BGA Solder Ball Clearance ........................... 45Figure 7-16Bottom Termination Component .................... 47Figure 7-17Bottom Thermal Plane Termination ............... 48Figure 7-18Flattened Post Termination ........................... 49Figure 7-19P-Style Termination ....................................... 50Figure 10-1Radial Leaded Components whoseheight is greater than or equal totheir length or diameter IndividualRectangular Shaped Component .................. 57Figure 10-2Radial Leaded Components whose heightis greater than or equal to their length ordiameter Individual Cylindrically ShapedComponent ........................................ ............ 57TablesTable 1-1Design, Fabrication and AcceptabilitySpecifications ........................................ .......... 3Table 3-1Maximum Limits of Solder BathContaminant ........................................ ............ 8Table 4-1Solder Anomalies ........................................ .. 14Table 5-1Allowable Strand Damage ............................. 15Table 5-2Terminal Mounting Minimum SolderingRequirements ........................................ ........ 17Table 5-3Turret and Straight Pin Wire Placement ....... 19Table 5-4AWG 30 and Smaller Wire WrapRequirements ........................................ ........ 19Table 5-5Bifurcated Terminal Wire Placement Side Route with Wrap ................................... 20Table 5-6Bifurcated Terminal Side RouteStraight-Through Staking Requirements ....... 20Table 5-7Bifurcated Terminal Wire Placement Bottom Route ........................................ ........ 20Table 5-8Hook Terminal Wire Placement ..................... 21Table 5-9Pierced or Perforated Terminal WirePlacement ........................................ .............. 21Table 5-10Solder Requirements Lead/Wire to Post ...... 22Table 6-1Component to Land Clearance ..................... 24Table 6-2Components with Spacers ............................ 24Table 6-3Lead Bend Radius ........................................ . 25Table 6-4Protrusion of Leads in Supported Holes ....... 25Table 6-5Protrusion of Leads in Unsupported Holes ... 25Table 6-6Supported Holes with Component Leads,Minimum Acceptable Conditions ................... 26Table 6-7Unsupported Holes with Component Leads,Minimum Acceptable Conditions ................... 27Table 7-1SMT Lead Forming Minimum LeadLength (L) ........................................ .............. 28Table 7-2Surface Mount Components ......................... 30Table 7-3Dimensional Criteria Bottom Only ChipComponent Terminations .............................. 31Table 7-4Dimensional Criteria Rectangularor Square End Chip Components 1, 2, 3 or 5 Side Termination(s) .................... 32Table 7-5Dimensional Criteria Cylindrical EndCap Terminations ........................................ .. 33Table 7-6Dimensional Criteria CastellatedTerminations ........................................ .......... 34Table 7-7Dimensional Criteria Flat Gull WingLeads ........................................ ..................... 35Table 7-8Dimensional Criteria Round or Flattened(Coined) Gull Wing Leads ............................. 36IPC J-STD-001GOctober 2017xTable 7-9Dimensional Criteria J Leads ..................... 37Table 7-10Dimensional Criteria Butt/I Connections .... 38Table 7-11Dimensional Criteria Butt/I Terminations Solder Charged Terminations ........................ 39Table 7-12ADimensional Criteria Power DissipatingFlat Lug Leads ........................................ ...... 40Table 7-12BDimensional Criteria Flat UnformedLeads, , flexible circuitry termination ....... 40Table 7-13Dimensional Criteria Tall ProfileComponents Having Bottom OnlyTerminations ........................................ .......... 42Table 7-14Dimensional Criteria Inward FormedL-Shaped Ribbon Leads ............................... 43Table 7-15Dimensional Criteria Ball Grid ArrayComponents with Collapsing Balls ................ 45Table 7-16Ball Grid Array Components withNoncollapsing Balls ....................................... 46Table 7-17Column Grid Array ........................................ . 46Table 7-18Dimensional Criteria BTC .......................... 47Table 7-19Dimensional Criteria Bottom ThermalPlane Terminations ........................................ 48Table 7-20Dimensional Criteria Flattened PostConnections ........................................ ........... 49Table 7-21Dimensional Criteria P-StyleTerminations ........................................ .......... 50Table 8-1Designation of Surfaces to be Cleaned ........ 51Table 8-2Cleanliness Testing Designators ................... 51Table 10-1Coating Thickness ........................................ . 55Table 12-1Magnification Aid Applications for SolderConnections ........................................ ........... 59Table 12-2Magnification Aid Applications for Wiresand Wire Connections ................................... 59Table 12-3Magnification Aid Applications Other ......... 59October 2017IPC J-STD-001GxiRequirements for Soldered Electricaland Electronic Assemblies1 ScopeThis Standard describes materials, methods and acceptance criteria for producing soldered electricaland electronic assemblies. The intent of this document is to rely on process control methodology to ensure consis-tent quality levels during the manufacture of products. It is not the intent of this Standard to exclude any procedure for com-ponent placement or for applying flux and solder used to make the electrical PurposeThis Standard prescribes material requirements, process requirements, and acceptability require-ments for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding ofthis document s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and IPC-A-610. Standards may be updated at any time, including with the addition of amendments. The use of anamendment or a newer revision is not automatically ClassificationThis Standard recognizes that electrical and electronic assemblies are subject to classifications byintended end-item use. Three general end-product classes have been established to reflect differences in manufacturability,complexity, functional performance requirements, and verification (inspection/test) frequency. It should be recognized thatthere may be overlaps of equipment between User, see , is responsible for defining the product class. The product class should be stated in the procurementdocumentation 1 General Electronic ProductsIncludes products suitable for applications where the major requirement is function of the completed 2 Dedicated Service Electronic ProductsIncludes products where continued performance and extended life is required, and for which uninterrupted service is desiredbut not critical. Typically the end-use environment would not cause 3 High Performance/Harsh Environment Electronic ProductsIncludes products where continued high performance or performance-on-demand is critical, equipment downtime cannot betolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as lifesupport or other critical Measurement Units and ApplicationsThis Standard uses International System of Units (SI) units per ASTM SI10,IEEE/ASTM SI 10, Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in thisStandard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius ( C) [ F] for temperature and tem-perature tolerances, grams (g) [oz] for weight, and lumens (lm) [footcandles] for :This Standard uses other SI prefixes (ASTM SI10, Section ) to eliminate leading zeroes (for example, mmbecomes m) or as alternative to powers-of-ten ( x 103mm becomes m). Verification of DimensionsActual measurement of specific part mounting and solder fillet dimensions and determi-nation of percentages are not required except for referee purposes. For determining conformance to the specifications in thisStandard, round all observed or calculated values to the nearest unit in the last right-hand digit used in expressing thespecification limit, in accordance with the rounding method of ASTM Practice E29. For example, specifications of mmmax, mm max, or mm max, round the measured value to the nearest mm, mm, or mm, respec-tively, and then compare to the specification number Definition of RequirementsThe wordsshallorshall notare used in the text of this document wherever there is arequirement for materials, preparation, process control or acceptance of a soldered 2017IPC J-STD-001G1

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